Summary: 1. The primary responsibilities will focus on Design for Manufacturability (DFM) for PCB and PCBA. 2. Driving the engineering development process from concept to mass production and resolving complex engineering challenges. 3. The candidate will possess deep expertise in substrate/board-level design rules, materials, assembly processes, and failure analysis to ensure robust, reliable, and cost-effective module packaging solutions. RESPONSIBILITIES: 1. DFM Leadership for PCB/PCBA: Serve as the DFM authority for module packaging, conducting thorough design reviews of PCB layout, stack-up, and PCBA assembly drawings. 2. Establish and enforce comprehensive DFM guidelines and constraints for PCB fabrication (trace/spacing, via design, impedance control) and PCBA assembly (component placement, solder mask, stencil design). 3. Collaborate closely with IC, substrate, and board design teams to optimize designs for yield, reliability, and cost-effectiveness. 4. Proactively identify and mitigate potential manufacturing, testability, and reliability risks during the design phase. 5. Lead the end-to-end engineering development of chip-on-board (CoB), system-in-package (SiP), and other complex module packages. 6. Own the process development and qualification for critical PCBA assembly steps, including SMT, die attach, wire bonding/FC, underfill, molding, and final coating. 7. Lead root cause analysis and resolution of engineering issues arising during NPI and high-volume manufacturing, utilizing structured problem-solving methodologies (8D, DMAIC). REQUIREMENTS: 1. Expert-level knowledge of PCB/PCBA design, materials, and fabrication/assembly processes. Familiarity with IPC standards is required. 2. Deep understanding of SMT, flip-chip, wire-bond, underfill, and molding processes for advanced packages. 3. Proficient in using DFM analysis software and CAD tools (e.g., CAM350, Allegro, AutoCAD). 4. Strong experience in Failure Analysis techniques (X-ray, SEM/EDX, CSAM, cross-sectioning) and Design of Experiments (DOE). 5. Minimum of 10 years of hands-on experience, with a strong focus on module-level development, PCB/PCBA DFM, and process engineering